Alliance Memory, Inc.
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AS4C256M8D2-25BINTR
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AS4C256M8D2-25BINTR

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-speed operation
    • Low power consumption
    • Small form factor
  • Package: BGA (Ball Grid Array)
  • Essence: Dynamic Random Access Memory (DRAM)
  • Packaging/Quantity: Tray, 250 units per tray

Specifications

  • Part Number: AS4C256M8D2-25BINTR
  • Organization: 256 Megabit x 8
  • Speed: 25 ns
  • Voltage: 3.3V
  • Interface: Parallel
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C256M8D2-25BINTR has a total of 66 pins. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. A0
  12. A1
  13. A2
  14. A3
  15. A4
  16. A5
  17. A6
  18. A7
  19. A8
  20. A9
  21. A10
  22. A11
  23. A12
  24. A13
  25. A14
  26. A15
  27. A16
  28. A17
  29. A18
  30. A19
  31. A20
  32. A21
  33. A22
  34. A23
  35. A24
  36. A25
  37. A26
  38. A27
  39. A28
  40. A29
  41. A30
  42. A31
  43. /RAS
  44. /CAS
  45. /WE
  46. /CS0
  47. /CS1
  48. /CS2
  49. /CS3
  50. /CS4
  51. /CS5
  52. /CS6
  53. /CS7
  54. /OE
  55. /LB
  56. /UB
  57. /CE
  58. VCCQ
  59. VSSQ
  60. VREF
  61. VDDQ
  62. VSSQ
  63. DQS0
  64. DQS1
  65. DM0
  66. DM1

Functional Features

  • High-speed operation allows for quick data access and transfer.
  • Low power consumption ensures efficient use of energy.
  • Small form factor enables integration into compact electronic devices.

Advantages

  • Fast data processing and retrieval due to high-speed operation.
  • Energy-efficient design helps prolong battery life in portable devices.
  • Compact size allows for space-saving integration in electronic systems.

Disadvantages

  • Limited storage capacity compared to other memory technologies.
  • Susceptible to data loss in case of power failure or system malfunction.

Working Principles

The AS4C256M8D2-25BINTR is a dynamic random access memory (DRAM) module. It stores data in capacitors within the memory cells, which need to be periodically refreshed to maintain the stored information. When data is requested, the memory controller activates the appropriate row and column addresses to access the desired data.

Detailed Application Field Plans

The AS4C256M8D2-25BINTR is commonly used in various electronic devices and systems, including: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics - Industrial automation

Detailed and Complete Alternative Models

Some alternative models to the AS4C256M8D2-25BINTR include: - AS4C256M8D2A-25BINTR - AS4C256M8D2B-25BINTR - AS4C256M8D2C-25BINTR - AS4C256M8D2D-25BINTR

These alternative models offer similar specifications and functionality, providing flexibility in choosing the appropriate memory module for specific applications.

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Maglista ng 10 karaniwang tanong at sagot na nauugnay sa aplikasyon ng AS4C256M8D2-25BINTR sa mga teknikal na solusyon

Sure! Here are 10 common questions and answers related to the application of AS4C256M8D2-25BINTR in technical solutions:

  1. Q: What is AS4C256M8D2-25BINTR? A: AS4C256M8D2-25BINTR is a specific type of synchronous dynamic random-access memory (SDRAM) chip commonly used in electronic devices.

  2. Q: What is the capacity of AS4C256M8D2-25BINTR? A: AS4C256M8D2-25BINTR has a capacity of 256 megabits (32 megabytes).

  3. Q: What does the "25BINTR" in the part number signify? A: The "25BINTR" indicates that the chip operates at a speed of 250 MHz and is designed for industrial temperature range (-40°C to +85°C).

  4. Q: What are some typical applications of AS4C256M8D2-25BINTR? A: AS4C256M8D2-25BINTR is commonly used in various technical solutions such as networking equipment, telecommunications devices, industrial control systems, and automotive electronics.

  5. Q: What is the voltage requirement for AS4C256M8D2-25BINTR? A: AS4C256M8D2-25BINTR operates at a supply voltage of 2.5V.

  6. Q: Can AS4C256M8D2-25BINTR be used in both commercial and industrial applications? A: Yes, AS4C256M8D2-25BINTR is suitable for both commercial and industrial applications due to its wide operating temperature range.

  7. Q: Does AS4C256M8D2-25BINTR support any specific memory interface standard? A: AS4C256M8D2-25BINTR supports the industry-standard synchronous DRAM (SDRAM) interface.

  8. Q: Can AS4C256M8D2-25BINTR be used as a drop-in replacement for other SDRAM chips? A: Yes, AS4C256M8D2-25BINTR is designed to be pin-compatible with other 256Mb SDRAM chips, making it easy to replace them in existing designs.

  9. Q: What is the typical access time of AS4C256M8D2-25BINTR? A: AS4C256M8D2-25BINTR has a typical access time of 5.4 ns, which ensures fast data retrieval.

  10. Q: Is AS4C256M8D2-25BINTR available in other package options? A: Yes, AS4C256M8D2-25BINTR is available in different package options such as TSOP, BGA, and FBGA, providing flexibility for various design requirements.

Please note that the answers provided here are general and may vary depending on the specific application and requirements.