Micron Technology Inc.
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MT29F4G08ABBDAH4:D

MT29F4G08ABBDAH4:D

Basic Information Overview

  • Category: Memory Device
  • Use: Data storage and retrieval
  • Characteristics:
    • Non-volatile
    • High capacity
    • Fast read/write speeds
  • Package: BGA (Ball Grid Array)
  • Essence: Flash memory chip
  • Packaging/Quantity: Individual chip

Specifications

  • Capacity: 4 gigabytes (GB)
  • Interface: Parallel
  • Voltage: 3.3 volts (V)
  • Organization: 512 megabits x 8 bits
  • Access Time: 25 nanoseconds (ns)
  • Operating Temperature: -40 to 85 degrees Celsius

Detailed Pin Configuration

The MT29F4G08ABBDAH4:D flash memory chip has the following pin configuration:

  1. VCC: Power supply voltage
  2. A0-A18: Address inputs
  3. DQ0-DQ7: Data input/output lines
  4. WE#: Write enable control
  5. CE#: Chip enable control
  6. RE#: Read enable control
  7. CLE: Command latch enable
  8. ALE: Address latch enable
  9. WP#: Write protect control
  10. RY/BY#: Ready/busy status output
  11. RP#/VP#: Reset/power down control
  12. NC: No connection
  13. VSS: Ground

Functional Features

  • High-speed data transfer
  • Reliable data retention
  • Block erase and program operations
  • Error correction code (ECC) support
  • Wear-leveling algorithm for extended lifespan
  • Bad block management

Advantages

  • Large storage capacity
  • Fast read/write speeds
  • Low power consumption
  • Compact package size
  • High reliability and durability

Disadvantages

  • Limited write endurance
  • Higher cost compared to other memory technologies
  • Susceptible to data loss in case of power failure

Working Principles

The MT29F4G08ABBDAH4:D flash memory chip utilizes NAND flash technology. It stores data in a series of memory cells organized in a grid-like structure. Each cell can store multiple bits of information by varying the electrical charge on its floating gate. To read or write data, the chip applies voltage to specific cells and measures the resulting electrical current.

Detailed Application Field Plans

The MT29F4G08ABBDAH4:D flash memory chip is commonly used in various electronic devices, including: - Solid-state drives (SSDs) - USB flash drives - Memory cards - Embedded systems - Consumer electronics (e.g., smartphones, tablets)

Detailed and Complete Alternative Models

Some alternative models to the MT29F4G08ABBDAH4:D flash memory chip include: - Samsung K9F4G08U0D - Micron MT29F4G08ABADA - Toshiba TH58NVG8T2JTA20

These alternative models offer similar specifications and functionality, providing options for different manufacturers and applications.

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Maglista ng 10 karaniwang tanong at sagot na nauugnay sa aplikasyon ng MT29F4G08ABBDAH4:D sa mga teknikal na solusyon

Sure! Here are 10 common questions and answers related to the application of MT29F4G08ABBDAH4:D in technical solutions:

  1. Q: What is MT29F4G08ABBDAH4:D? A: MT29F4G08ABBDAH4:D is a specific model of NAND flash memory chip manufactured by Micron Technology.

  2. Q: What are the key features of MT29F4G08ABBDAH4:D? A: Some key features of MT29F4G08ABBDAH4:D include a capacity of 4GB, a supply voltage range of 2.7V to 3.6V, and support for asynchronous page read operations.

  3. Q: What are the typical applications of MT29F4G08ABBDAH4:D? A: MT29F4G08ABBDAH4:D is commonly used in various electronic devices such as smartphones, tablets, digital cameras, and solid-state drives (SSDs).

  4. Q: How does MT29F4G08ABBDAH4:D connect to a system? A: MT29F4G08ABBDAH4:D typically connects to a system using a standard NAND flash interface, such as the Open NAND Flash Interface (ONFI) or Toggle Mode.

  5. Q: What is the data transfer rate of MT29F4G08ABBDAH4:D? A: The data transfer rate of MT29F4G08ABBDAH4:D depends on the specific interface used, but it can typically achieve speeds of several hundred megabytes per second.

  6. Q: Can MT29F4G08ABBDAH4:D be used as a boot device? A: Yes, MT29F4G08ABBDAH4:D can be used as a boot device in systems that support booting from NAND flash memory.

  7. Q: Does MT29F4G08ABBDAH4:D support error correction codes (ECC)? A: Yes, MT29F4G08ABBDAH4:D supports various ECC algorithms to ensure data integrity and reliability.

  8. Q: Can MT29F4G08ABBDAH4:D be used in industrial applications? A: Yes, MT29F4G08ABBDAH4:D is designed to meet the requirements of industrial-grade applications, including extended temperature ranges and high endurance.

  9. Q: What is the lifespan of MT29F4G08ABBDAH4:D? A: The lifespan of MT29F4G08ABBDAH4:D depends on various factors such as usage patterns and operating conditions, but it typically has a high endurance rating, allowing for many years of use.

  10. Q: Are there any specific programming considerations for MT29F4G08ABBDAH4:D? A: Yes, when programming MT29F4G08ABBDAH4:D, it is important to follow the manufacturer's guidelines and specifications to ensure proper operation and data integrity.

Please note that these answers are general and may vary depending on the specific implementation and requirements of the technical solution.