Xilinx Inc.
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Tingnan ang mga detalye para sa mga detalye ng produkto.
XCKU3P-3FFVD900E
Tingnan ang Higit pang Impormasyon DataSheets

XCKU3P-3FFVD900E

XCKU3P-3FFVD900E
Numero ng Bahagi
XCKU3P-3FFVD900E
Manufacturer/Brand
Xilinx Inc.
Serye
Kintex® UltraScale+™
Katayuan ng Bahagi
Active
Operating Temperatura
0°C ~ 100°C (TJ)
Uri ng Pag-mount
Surface Mount
Package / Case
900-BBGA, FCBGA
Package ng Supplier ng Device
900-FCBGA (31x31)
Boltahe - Supply
0.873 V ~ 0.927 V
Bilang ng Gates
-
Bilang ng I/O
304
Bilang ng mga LAB/CLB
20340
Bilang ng Logic Elements/Cell
355950
Kabuuang Mga Bit ng RAM
31641600
Humiling ng Quote
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Sa Stock 36223 PCS
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Mga keyword ng XCKU3P-3FFVD900E
XCKU3P-3FFVD900E Mga elektronikong bahagi
XCKU3P-3FFVD900E Benta
XCKU3P-3FFVD900E Supplier
XCKU3P-3FFVD900E Distributor
XCKU3P-3FFVD900E Talahanayan ng data
XCKU3P-3FFVD900E Mga larawan
XCKU3P-3FFVD900E Presyo
XCKU3P-3FFVD900E Alok
XCKU3P-3FFVD900E Pinakamababang presyo
XCKU3P-3FFVD900E Maghanap
XCKU3P-3FFVD900E Pagbili
XCKU3P-3FFVD900E Chip